YIG TECHNOLOGY

MicroComm’s capabilities also include YIG (Yttrium Iron Garnet) technology. This special know-how allow us to provide YIG-based components custom design and remanufacturing services. We can redesign and rebuild YIG-tuned oscillators, YIG-tuned filters, Multipliers, Synthesizers, Harmonic Generators.

WIRE BONDING

Wire bonding is the main method of making interconnections between a an integrated circuit (IC) or a semiconductor die and a package or substrate. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.
We have the ability to wire bond and precision die attach onto a variety of substrates using a wide range of bonding materials including gold or aluminium – down to a wire diameter of just 18 microns – useful for client’s wanting miniature microelectronic solutions.
MicroComm’s expertise and capability in wire bonding are also used to rebuild RF microcircuits and microwave components. MicroComm offers wire bonding services utilizing advanced automated wire bonding equipment.

ENGINEERING DESIGN

Our engineering design picks cover mechanical, electrical, and structural engineering design needs and include CAD programs and simulation tools. Our engineering also expertise with all major FPGA devices and associated tools.

CNC LAB AND RAPID PROTOTYPING EQUIPMENT

We use compact and automatic machines for manufacturing prototype circuit boards and mechanical modules:

• Rapid PCB Prototyping
• Rapid CNC Engraving Prototyping

RF ELECTRONIC LAB AND EQUIPMENT

We provide a wide range of professional diagnostic, test, rebuilding services for RF devices thanks to our well-equipped Electronic laboratory.
Our Electronic lab is well equipped for RF and Microwave measurement, characterization and prototyping. The major equipment in the laboratories includes Vector Signal Generators, Vector Signal Analyzers, Vector Network Analyzers, and Spectrum Analyzers.

We offer Temperature and Humidity test services with our Climate Chamber. The climate chamber handles temperatures from -70° to 180° with humidity values from 10 % to 95 % rH. The lifetime effects of product exposure to such climate-related conditions as extreme temperatures or humidity changes can be modelled using our climate chamber that allows for accelerated studies:

• RF Test & Measurement equipment (RF measurements up to 80GHz and beyond)
• Temperature and Humidity Test chamber

CLEANROOM AND WIRE BONDING EQUIPMENT

At MicroComm, we have a custom cleanroom, a controlled environment with a low level of pollutants such as dust, airborne microbes, aerosol particles, and chemical vapors.
Our cleanroom is well equipped with necessary manufacturing tools used in microcircuit manufacturing process. Our Enginnering team utilizes advanced Chip on Board (COB) technology ensuring microchips are fastened on printed circuit boards. Through wire bonding, the I/O on the chip is secured to the PCB. Epoxy resin is used to encapsulate the chips to prevent breakage or bending of the thin wires. The PCB are placed in ovens for the resins to harden in order to offer adequate protection to the chips and wire.
Our bonding equipment includes 6 bonding machines, one CNC controlled die setting machine, one CNC controlled encapsulation machine and three ovens.